Semiconductor fabs.
Front-end wafer cleanrooms, advanced packaging, compound semi. Renka has been on site in the EU semiconductor cluster for over 15 years - in Saxony, in the Po Valley, in Crolles, in the Brainport region. With live-fab experience, not just greenfield construction. Current focus is the EU Chips Act pipeline.
Where fabs are actually being built.
The EU Chips Act pipeline is more concentrated in 2026 than the headlines suggest. Intel Magdeburg halted. ST/GF Crolles deferred. Wolfspeed Ensdorf frozen. What remains: ESMC Dresden (TSMC joint venture, tool move-in H2 2026), Infineon Smart Power Fab Dresden (production start 2026) and GlobalFoundries Dresden (SPRINT project, EUR 1.1bn capacity expansion, groundbreaking March 2026). Together: 80,000+ m² of new ISO 5 to ISO 7 cleanroom space, 110 km from Jablonec.
What we deliver at a wafer fab.
- Front-end cleanrooms ISO 14644-1 Class 1-5 with laminar airflow 0.36-0.54 m/s
- Sub-fab HVAC, AHU assembly, pressure cascade connection including validation
- AMHS integration (automated material handling systems)
- Chase areas and tool hookup during scheduled maintenance windows
- UPW, bulk gas and chemical supply lines (orbital TIG)
- Shutdown retrofit within the shutdown window with FOD discipline
- IQ/OQ support, particle count to ISO 14644-3, as-built drawings
Who is on the client list.
From the confirmed end-client list of the last 15 years: 9 of the top 12 EU semiconductor names, including leading wafer manufacturers, front-end IDMs, foundries and specialist manufacturers for compound and power semi. Specific names exclusively in the prequalification dossier.
Request client listRequest semiconductor capability sheet.
ISO class matrix, tool hookup experience, AMHS references, mobilisation lead times.